1. 2. 3. material content data sheet sales product name tle9266qx issued 28. august 2013 ma# MA001089750 package pg-vqfn-48-31 weight* 129.51 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 3.168 2.45 2.45 24459 24459 leadframe inorganic material phosphorus 7723-14-0 0.018 0.01 138 non noble metal zinc 7440-66-6 0.072 0.06 553 non noble metal iron 7439-89-6 1.433 1.11 11066 non noble metal copper 7440-50-8 58.193 44.94 46.12 449337 461094 wire non noble metal copper 7440-50-8 0.502 0.39 0.39 3875 3875 encapsulation organic material carbon black 1333-86-4 0.186 0.14 1436 plastics epoxy resin - 7.874 6.08 60797 inorganic material silicondioxide 60676-86-0 53.938 41.65 47.87 416482 478715 leadfinish non noble metal tin 7440-31-5 2.596 2.00 2.00 20048 20048 plating noble metal silver 7440-22-4 0.614 0.47 0.47 4740 4740 glue plastics epoxy resin - 0.211 0.16 1626 noble metal silver 7440-22-4 0.705 0.54 0.70 5443 7069 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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